GRAPHENE SUPERMARKET

製品名

Single Layer Graphene on Copper Foil

サイズ・数量・仕様

Size: 2"x2" / 2"x4" / 4"x4"
Copper foil thickness: 25 micron

製品名

5 Pack: Graphene Transfer Tape

サイズ・数量・仕様

Specifications:
Size: 200 mm x 200 mm
One-sided
100ºC release temperature

製品名

Monolayer Graphene on 285 nm SiO2 Wafer

サイズ・数量・仕様

Set: 5-pack / 10-pack
A 5 pack of monolayer graphene on
1cm x 1cm silicon wafers with 90
nanometer silicon dioxide coating.

製品名

Multilayer h-BN (Boron Nitride) Film grown on Copper Foil: 2" x 1"

サイズ・数量・仕様

Close to complete coverage (90-95%),
with some minor holes Average Thickness
of BN film is 13 nmThickness of the copper
foil is 20 microns Quality is confirmed by TEM.
TEM shows perfect hexagonal structure.

製品名

Single layer h-BN (Boron Nitride) Film grown on Copper Foil: 2" x 1"

サイズ・数量・仕様

Close to complete coverage (90-95%),
with some minor holesThickness of
the copper foil is 25 microns High
crystalline quality, see SAD
(Selected area [electron] diffraction) data
Quality is confirmed by TEM.
TEM shows perfect hexagonal structure.

製品名

3D Multilayer Freestanding Graphene Foam

サイズ・数量・仕様

Sample Size 2 inch x 2 inch
Thickness 1.2 mm
Carbon Content 99%, no metal support
Density 4 mg/cm3
Pore Size 580 microns

製品名

CVD Graphene Film/CVD h-BN Film
Heterostructure on SiO2/Si wafer

サイズ・数量・仕様

4-pack / 8-pack
Single Layer Graphene Film on Single Layer
h-BN Film transferred onto 285 nm (p-doped)
SiO2/Si wafer
Size: 1cmx1cm;
The thickness and quality of each film is controlled by Raman Spectroscopy
The coverage of this product is about 98%

製品名

Multilayer Graphene on Nickel Foil: 2"x2"

サイズ・数量・仕様

Description One 2"x2" sheet Nickel foil
thickness: 25 micron We offer multilayer
graphene films that are about 500-800 nm
thick on average.

製品名

Blank Quartz Substrate: 1" x 1"

サイズ・数量・仕様

Single / 5-pack
Description
Blank quartz substrate, size 1" x 1" inch by 1 mm

製品名

Double Sided Graphene Transfer Tape: 5 Pack

サイズ・数量・仕様

Specifications:
Size: 200 mm x 200 mm
100ºC release temperature

製品名

Monolayer Graphene on 90 nm SiO2 Wafer: 5 pack

サイズ・数量・仕様

A 5 pack of monolayer graphene on
1cm x 1cm silicon wafers with 90
nanometer silicon dioxide coating.

製品名

Multilayer Graphene on 285 nm Silicon Dioxide Wafer

サイズ・数量・仕様

Multilayer CVD-grown graphene transferred
onto 1cm x 1cm silicon wafers (p-doped)
with a 285 nanometer silicon dioxide coating.

製品名

CVD Graphene TEM Grid on Copper 2000 support

サイズ・数量・仕様

CVD Graphene film deposited on Copper TEM grids (2000 Mesh).
We use CVD graphene grown on Ni to prepare TEM grids
Thickness of CVD Graphene film: 0.3-2 nm (1-6 monolayers)
Typical graphene coverage: 60-90%
Ultrathin CVD Graphene grids provide the ideal specimen
support to achieve high resolution data in TEM imaging
making them an ideal choice many TEM applications such as:

製品名

3D Multilayer Graphene Film on Nickel Foam

サイズ・数量・仕様

Sample Size 2 inch x 2 inch | 2 inch x 4 inch
Thickness 1.2 mm
Density 320 mg/cm3
Pore Size 580 microns

製品名

Monolayer Graphene on PET Size: 1"x1"

サイズ・数量・仕様

Monolayer graphene film is grown by CVD processing
onto copper foil, then transferred onto PET
(Polyethylene terephthalate)

製品名

Monolayer Graphene Film on Quartz; Size: 1"x1"

サイズ・数量・仕様

Monolayer graphene film is grown by CVD processing
onto copper foil, then transferred onto quartz

製品名

Monolayer Graphene Film on Glass; Size: 1"x1"

サイズ・数量・仕様

Monolayer graphene film is grown by CVD processing
onto copper foil, then transferred onto glass
Sample Size: 1"x 1"

製品名

Blank Glass Substrate: 1"x1"

サイズ・数量・仕様

Blank glass substrate, size 1" x 1"
Thickness: 0.7 mm
Density: 2.38 g/cc

製品名

One Wafer 100mm (4 in): Graphene Film on Nickel

サイズ・数量・仕様

Graphene on nickel is a few monolayers thick, usually between 1-7 layers
with an average of 4 monolayer thickness. It looks like a patchwork,
whereas each “patch” has a different thickness. The graphene layers
within the same patch are aligned relative to each other (there is a graphitic
AB-stacking order). The size of each patch is about 3-10 microns.

Because graphene on nickel is grown in patches with different layering,
the Raman signal will change dramatically depending on the spot of the film
where it is taken. If nickel is used as a catalyst, it is not possible to create a
graphene sheet with a precise and uniform layering.

製品名

Two Layers of CVD Graphene Film on SiO2/Si Wafer

サイズ・数量・仕様

Two layers of single layer CVD graphene films are transferred
onto 285 nm p-doped SiO2/Si wafer
Size: 1cmx1cm; 4 pack

製品名

Coronene: 250 mg

サイズ・数量・仕様

Coronene serves applications in the CVD processing of graphene
for controlled growth with less defects; it can be used as nucleation
seeds to improve graphene growth at low temperatures, which has
cost advantages over high-temperature graphene growth for
large-scale production.
Purity: 97%
Form: Yellow-Yellow Gold Fibrous Powder
Weight: 250 mg

製品名

Ultra Highly Concentrated Single-Layer Graphene Oxide

サイズ・数量・仕様

Concentration: 6.2 g/L
Single Layer: >80%
Flake Size: 0.5-5 Microns
Color: Brown
Highly Viscous
Aqueous Solution

製品名

Highly Concentrated Graphene Oxide

サイズ・数量・仕様

Aqueous dispersion
Concentration: 5g/L, 0.33g per 60ml bottle
Composition: Carbon (≥ 46%), Oxygen (≤ 46%)
Flake size: 0.5-5 microns
Thickness: 1 atomic layer - at least 60%.
Color: Brown

製品名

Dispersion in Water: Single Layer Graphene Oxide

サイズ・数量・仕様

Aqueous dispersion
Concentration: 500 mg/L
Composition: Carbon (79%), Oxygen (20%)
Flake size: 0.3-0.7 microns
Thickness: 1 atomic layer - at least 80%.
Color:Brown

製品名

Graphene Oxide Paste

サイズ・数量・仕様

Concentration: 30 g/L - 35g/L
Single Layer > 80%
Flake Size: 0.5-5 Microns
Color: Brown
Water based paste
Sizes: 30 ml and 60 ml

製品名

Single Layer Graphene Oxide

サイズ・数量・仕様

Our GO powders have improved dispersibility in various solvents.
An aqueous solution may be prepared by mixing GO powder in water
then sonicating the dispersion for an additional hour. Graphene oxide
layers are about 1.1 ± 0.2 nm thick.
Dry powder
Color: Brown
Composition: Carbon (79%), Oxygen (20%)
Flake size: 0.5-5 microns.
Thickness: 1 atomic layer - at least 80%.

製品名

Single Layer Graphene Oxide (Small Flakes): 1g

サイズ・数量・仕様

Graphene oxide disperses readily in water and other solvents,
breaking up into macroscopic flakes, mostly one layer thick.
Graphene oxide layers are about 1.1 ± 0.2 nm thick.

Dry paper-like powder
Color: Brown
Composition: Carbon (79%), Oxygen (20%)
Flake size: 0.3-0.7 microns.
Thickness: 1 atomic layer - about 50%.

製品名

High Surface Area Reduced Graphene Oxide 75 mg

サイズ・数量・仕様

75 MG (DRY BLACK POWDER)
Specific surface area: 833 m2/g
Color: Black
Solid content: 98%
Carbon/Oxygen Ratio: 10.5
Average flake thickness: 1 monolayer
Average Particle (lateral) size: ~3-5 microns.

製品名

Nano Graphene Oxide Solution, 125 ml

サイズ・数量・仕様

125 ml solution of 1g/L Nano Graphene Oxide Aqueous Solution
Diameter: 90nm-200nm
Thickness: about 1 nm
Single Layer Ratio: >99%
Purity: >99%
Color: Light Brown (different from display picture)

製品名

Nano Graphene Oxide Powder, 100 mg

サイズ・数量・仕様

Diameter: 90nm-200nm
Thickness: about 1 nm
Single Layer Ratio: >99%
Purity: >99%

製品名

サイズ・数量・仕様

製品名

Graphene Aerogel

サイズ・数量・仕様

Density: 12.5 mg/cm3
Electrical conductivity: 1-10x10-4 S cm-1
Approximate Dimensions:
1. Cylindrical Shape:
Diameter: 2.3 cm (0.9 inches)
Height: 1.5cm (0.6 inches)
2. Rectangular Shape:
Length: 7.1cm (2.8 inches)
Width: 6.6cm (2.6 inches)
Height: 1.3cm (0.52 inches)

製品名

High Porosity Reduced Graphene Oxide

サイズ・数量・仕様

Specific surface area: about 400 m2/g
Color: Black
Solid content: 98%
Average flake thickness: 1 monolayer
Average Particle (lateral) size: ~3-10 microns.
Flakes have multiple openings and holes
Improved solubility in organic solvents

製品名

Graphene Oxide Foam Granules (0.5g)

サイズ・数量・仕様

Sample Size: 0.5g
Purity: >99%
Density: 30 mg/cm3
Average Granule Size: 3 - 10 millimeters

製品名

Reduced Graphene Oxide Foam Granules (0.5g)

サイズ・数量・仕様

Sample Size: 0.5g
Purity: >99%
Density: 20 mg/cm3
Average Granule Size: 3 - 10 millimeters
Volume Conductivity: 5 Ohm x cm

製品名

SILVER/GRAPHENE CONDUCTIVE EPOXY G6E-SG

サイズ・数量・仕様

There is a strong demand for high-performance conductive adhesives in many industries including electronics, packaging, and applications such as die attachments and solderless interconnections, component repair, display interconnections, etc. G6E-SG adhesive performs two primary functions: First, conductive adhesives form joints with sufficient strength to bond two surfaces together, and second, an electrical interconnection forms between the two bonded surfaces. Traditional epoxy materials tend to be brittle and are prone to mechanical failure. Graphene adds superior durability, fatigue and crack resistance in addition to low electrical resistance. G6E-SG can cure at room temperature or more rapidly at elevated temperatures. G6E-SG has a paste-like consistency after mixing and bonds well to a wide variety of substrates including metals, composites, ceramics, and glass.

製品名

FLEXIBLE CARBON FILLED CONDUCTIVE EPOXY G6E-FRP

サイズ・数量・仕様

Our Conductive Nanocarbon Filled G6E-FRP epoxy is a more-flexible, lower-stress version of G6E-P epoxy. It is a two-component, electrically-conductive adhesive formulated with a mixture of nanocarbon particles designed to combine high flexibility and good electrical/mechanical properties. G6E-FRP can be used for high performance bonding, sealing and coating. The conductivity of G6E-FRP is not sensitive to curing temperatures or ambient conditions.

製品名

FLEXIBLE SILVER/GRAPHENE CONDUCTIVE EPOXY G6E-FXSG

サイズ・数量・仕様

G6-FXSG is a flexible, two-component, electrically-conductive high-performance adhesive well suited for bonding dissimilar materials that are likely to be subjected to vibrations, temperature variations, shock from impact, bending, and mechanical stress. We use a proprietary mix of silver and graphene materials to formulate an adhesive with an outstanding combination of flexibility and low electrical resistivity. Graphene adds superior durability, fatigue and crack resistance along with low electrical resistance.

Flexible Silver/Graphene Epoxy G6E-FXSG is a two-component adhesive for high-performance bonding, sealing and coating purposes. G6E-FXSG has a smooth, paste-like consistency after mixing and bonds well to a wide variety of substrates including metals, composites, ceramics, glass and plastics. This product is recommended for flexible electronics, membrane switches, medical devices, electronic packaging applications such as die attachment and solderless interconnections, component repair and display interconnections.

製品名

ROOM TEMPERATURE CURABLE CARBON FILLED CONDUCTIVE EPOXY G6E-RTC

サイズ・数量・仕様

Our Room Temperature Curable Nanocarbon Filled Electrically Conductive Epoxy, G6E-RTC, was developed and formulated primarily for applications requiring curing at ambient room temperature. G6E-RTC epoxy is formulated with proprietary nanomaterials and fillers to provide its performance characteristics. Room temperature curing eliminates the need for heating items to allow easier and safer connection of conductive components or materials. G6E-RTC epoxy is low cost (compared to silver), non-metallic with good electrical conductivity characteristics.

Ideal uses for G6E-RTC epoxy include printed circuit board and EMI/RFI shielding assembly and repair, and many other similar applications.

製品名

HIGH TEMPERATURE SILVER/GRAPHENE CONDUCTIVE EPOXY G6E-HTSG

サイズ・数量・仕様

Our Conductive High-Temperature Silver/Graphene G6E-HTSG is a two-component adhesive intended for high performance bonding, sealing and coating purposes. G6E-HTSG Epoxy has been developed for applications that require high-temperature operation (up to 316°C/600°F), excellent moisture and chemical resistance. We use a proprietary mix of silver and graphene materials to achieve a superb combination of mechanical and electrical properties. G6E-HTSG is a two-component, electrically conductive adhesive that is engineered to combine bond strength and high electrical conductivity. The epoxy composite is based on a proprietary mixture of graphene and silver particles. The graphene nanoparticles increase the electrical conductivity of the epoxy, enhance the strength of the material and prevent the formation of cracks, improving the durability of the bond. This is especially important for bonding dissimilar materials subjected to temperature variations and shocks.

G6E-HTSG offers superb resistance to moisture, solvents and oxidants as well as exceptional durability. This adhesive can also be used as a solder replacement for applications where high temperature performance is desirable.

製品名

CARBON FILLED CONDUCTIVE EPOXY G6E-P

サイズ・数量・仕様

G6-Epoxy G6E-P is a two component, electrically conductive epoxy for high performance bonding, sealing and coating. We use a proprietary mix of high-performance nanocarbon fillers to achieve superb electrical properties for a non-metallic, electrically-conductive epoxy. It can cure at room temperature or more rapidly at elevated temperatures. G6E-P has a thick, pasty consistency after mixing and bonds well to a wide variety of substrates including metals, composites, ceramics, and glass.

製品名

ROOM TEMPERATURE CURABLE SILVER/GRAPHENE CONDUCTIVE EPOXY G6E-RTSG

サイズ・数量・仕様

G6E-RTSG epoxy is developed primarily for applications that require curing at room temperature. Room temperature curing eliminates the need for a heating oven. This allows easier and safer bond/connection of conductive components or materials. This epoxy is also formulated with proprietary nanomaterials and fillers to provide low electrical resistivity.

G6E-RTSG epoxy incorporates a proprietary graphene additive to enhance crack resistance. G6E-RTSG epoxy has outstanding electrical conductivity and is ideal for applications involving manufacture or repair of conductive and temperature sensitive components.

製品名

HIGH-TEMPERATURE FLEXIBLE SILVER/GRAPHENE CONDUCTIVE EPOXY G6E-HFSG

サイズ・数量・仕様

G6E-HFSG epoxy is intended for applications requiring a high-performance bond or connection of electrically conductive components/materials which operate at higher temperatures and require low electrical resistivity. G6E-HFSG is a two-component adhesive that is both flexible and has excellent electrical conductivity. This makes it well suited for bonding dissimilar materials that are likely to be subjected to vibrations, temperature vibrations, temperature variations, shock from impact, bending, and mechanical stress. We use a proprietary mix of silver and graphene materials to formulate an adhesive with an outstanding combination of flexibility and low electrical resistivity. Graphene fillers add superior durability, fatigue, and crack resistance. OPERATING TEMPERATURE: up to 260°C (500°F)

製品名

1K Nanocarbon Electrically Conductive Epoxy G6E-9KMBP

サイズ・数量・仕様

G6E-9KMBP is a single component epoxy system that is developed for general purpose applications requiring a high-performance bond or connection of electrically conductive components/materials that require low electrical resistivity. The system cures at 150°C/302°F in 30-40 minutes. It does not cure at
room temperature (25°C / 77°F), so it has an unlimited working time and there is no need for it to be stored frozen. We use a proprietary mix of high-performance carbon/graphene-based additives to achieve superb electrical properties for a non-metallic electrically conductive epoxy.

製品名

SILVER/CARBON CONDUCTIVE EPOXY G6E-NS10

サイズ・数量・仕様

Conductive epoxies can be used to form an electrically conductive bond between dissimilar materials, eliminating the need for soldering. Our Conductive Silver/Nanocarbon Epoxy G6E-NS10 has been developed based on advanced, proprietary technology that requires 25% or less silver content to be at par with leading silver based epoxies in terms of electrical properties. This improvement makes G6E-NS10 less prone to fracture and allows for stronger adhesion to the target substrate.

Silver/Nanocarbon Epoxy G6E-NS10 is a two-component adhesive for high performance bonding, sealing and coating purposes. G6E-NS10 has a smooth, paste-like consistency after mixing and bonds well to a wide variety of substrates including metals, composites, ceramics, glass and plastics. This product is recommended for electronic packaging applications such as die attachment and solderless interconnections, component repair and display interconnections.

製品名

G6E-HRBN Thermally Conductive Epoxy, High Operation Temperature, Room Temperature Curing

サイズ・数量・仕様

Our G6E-HRBN® Epoxy has been specifically formulated adhesives that not only bond materials together but also facilitate the transfer of heat. These epoxies are especially valuable in applications where heat dissipation or thermal management is critical.
G6E-HRBN cures at room temperature which eliminates the necessity for a heating oven, but still maintains a high operating temperature. To achieve this, the G6E-HRBN® Epoxy is formulated with a blend of proprietary nanomaterials, additives and fillers, ensuring high performance and adaptability to a wide range of conditions. Moreover, a defining feature of the G6E-HRBN® Epoxy is its incorporation of a proprietary graphene additive. Loading the adhesive with graphene enhances its cracking resistance, making it more resilient and capable of withstanding thermal cycling, mechanical stresses, and temperature variations without developing cracks or compromising the integrity of the bond.

製品名

G6E-1KMTS One-Component Thermally Conductive Epoxy

サイズ・数量・仕様

Our G6E-1KTMS™ Epoxy is a single component epoxy system that is developed for general purpose applications that necessitate the bonding or connecting of thermally conductive components/materials. It is designed to provide efficient heat transfer between components or surfaces, while also providing the bonding and adhesive properties of a traditional adhesive. This product is unique in that it also requires strong electrical resistance, thereby broadening its range of possible applications. To achieve this, the G6E-1KTMS™ Epoxy is formulated with a blend of proprietary nanomaterials, additives and fillers, ensuring high performance and adaptability to a wide range of conditions.

製品名

G6E-TSAL Thermally Conductive, Non-Electrically Conductive, Low Viscosity Epoxy

サイズ・数量・仕様

Our G6E-TSAL™ Epoxy has been specifically developed for general purpose applications that necessitate the bonding or connecting of thermally conductive components/materials. It is designed to provide efficient heat transfer between components or surfaces, while also providing the bonding and adhesive properties of a traditional adhesive. This product is unique in that it also requires strong electrical resistance, thereby broadening its range of possible applications. To achieve this, the G6E-TSAL™ Epoxy is formulated with a blend of proprietary nanomaterials, additives and fillers, ensuring high performance and adaptability to a wide range of conditions. Moreover, a defining feature of the G6E-TSAL™ Epoxy is its incorporation of a proprietary graphene additive. Loading the adhesive with graphene enhances its cracking resistance, making it more resilient and capable of withstanding thermal cycling, mechanical stresses, and temperature variations without developing cracks or compromising the integrity of the bond.

製品名

G6E-TSHV High Thermally Conductive , Non-Electrically Conductive Epoxy

サイズ・数量・仕様

Our G6E-TSHV™ Epoxy has been specifically developed for general purpose applications that necessitate the bonding or connecting of thermally conductive components/materials. It is designed to provide efficient heat transfer between components or surfaces, while also providing the bonding and adhesive properties of a traditional adhesive. This product is unique in that it also requires strong electrical resistance, thereby broadening its range of possible applications. To achieve this, the G6E-TSHV™ Epoxy is formulated with a blend of proprietary nanomaterials, additives and fillers, ensuring high performance and adaptability to a wide range of conditions. Moreover, a defining feature of the G6E-TSHV™ Epoxy is its incorporation of a proprietary graphene additive. Loading the adhesive with graphene enhances its cracking resistance, making it more resilient and capable of withstanding thermal cycling, mechanical stresses, and temperature variations without developing cracks or compromising the integrity of the bond.

製品名

1K Silver-Graphene Electrically Conductive Epoxy G6E-9KMSG

サイズ・数量・仕様

Single component G6E-9KMSG™ epoxy is developed for general purpose applications requiring high- performance bond or connection of electrically conductive components/materials that require low electrical resistivity. The system cures at 150°C / 302°F in 30-40 minutes. It does not cure at room temperature (25°C / 77°F), so it has an unlimited working time and there is no need for it to be stored frozen. Graphenefillers add superior durability, fatigue, and crack resistance along with low electrical resistance.

製品名

G6E-HRSG High Temperature Room Temperature Curing Silver/Graphene Conductive Epoxy

サイズ・数量・仕様

G6E-HRSG epoxy is intended for applications requiring a high-performance bond or connection of electrically conductive components/materials which operate at higher temperatures and require low electrical resistivity.

G6E-HRSG cures at room temperature which eliminates the necessity for a heating oven, but still maintains a high operating temperature. This allows for an easier and safer bond/connection of conductive components or materials. Graphene filler adds superior durability, fatigue, and crack resistance along with low electrical resistance. OPERATING TEMPERATURE: up to 260 0C (500F)

製品名

HIGH TEMPERATURE SILVER/CARBON CONDUCTIVE EPOXY G6E-HTNS

サイズ・数量・仕様

Our Conductive High-Temperature Silver/Carbon G6E-HTNS Epoxy has been developed for applications that require high-temperature operation (up to 316°C/600°F), excellent moisture and chemical resistance. Our G6E-NS series of epoxies has been developed based on advanced proprietary technology that requires less silver content to be at par with leading silver-based epoxies in terms of electrical properties. This improvement makes G6E-NS less dense, and allows for stronger adhesion to the target substrate. G6E-HTNS is a two-component, electrically conductive adhesive that is engineered to combine bond strength and high electrical conductivity. The epoxy composite is based on a proprietary nanocarbon and silver particle mixture.

The G6E-HTNS resin works in high temperature and demonstrates excellent adhesion to a variety of materials including plastics, metals, glass and ceramics. It offers superb resistance to moisture, solvents and oxidants as well as exceptional durability.

製品名

HIGH TEMPERATURE CARBON FILLED CONDUCTIVE EPOXY G6E-HTC

サイズ・数量・仕様

Our Conductive Nanocarbon Filled G6E-HTC is a two-component, electrically conductive epoxy developed for high performance, bonding, sealing and coating. G6E-HTC Epoxy is ideal for applications that require high-temperature (up to 315°C/600°F) processes with excellent moisture and chemical resistance properties. A proprietary mix of high-performance nanocarbon fillers enhance the electrical properties of the epoxy.

製品名

FLEXIBLE SILVER/CARBON CONDUCTIVE EPOXY G6E-FXNS

サイズ・数量・仕様

Our Conductive Silver/Carbon Flexible Epoxy G6E-FXNS Epoxy has been developed for applications that require high flexibility of solderless interconnections such as wearable electronics, flexible wires, and sensors.

Our G6E-NS series of epoxies was developed with advanced, proprietary technology requiring reduced silver content while performing on par with leading silver-based epoxies in terms of electrical properties. This innovation makes G6E-FXNS less dense, more flexible, and allows for stronger adhesion to the target substrate.

製品名

SILVER/CARBON CONDUCTIVE EPOXY G6E-NS11

サイズ・数量・仕様

Conductive epoxies can be used to form an electrically conductive bond between dissimilar materials, eliminating any need for soldering. Traditional silver-based epoxy materials require up to 80% weight load of silver fillers and as a result tend to be costly, brittle and prone to mechanical failure.

Our Conductive Silver/Carbon Epoxy G6E-NS11 has been developed, based on advanced proprietary technology that requires 20% or less silver content to be at par with leading silver-based epoxies in terms of electrical properties. G6E-NS11 is intended to be cured at elevated temperatures. G6E-NS11 has a smooth, paste-like consistency after mixing and bonds well to a wide variety of substrates including metals, composites, ceramics, glass and plastics. However, it has limited adhesion to rubber and silicon-based materials. This product is recommended for electronic packaging applications such as die attachment and solderless interconnections, component repair, display interconnections. Recommended curing temperature is 150°C/302°F.

製品名

Multilayer h-BN (Boron Nitride) Film grown on Copper Foil: 2" x 1"

サイズ・数量・仕様

lose to complete coverage (90-95%), with some minor holes
Average Thickness of BN film is 13 nm
Thickness of the copper foil is 20 microns
Quality is confirmed by TEM. TEM shows perfect hexagonal structure.

製品名

Single layer h-BN (Boron Nitride) Film grown on Copper Foil: 2" x 1"

サイズ・数量・仕様

Close to complete coverage (90-95%), with some minor holes
Thickness of the copper foil is 25 microns
High crystalline quality, see SAD (Selected area [electron] diffraction) data
Quality is confirmed by TEM. TEM shows perfect hexagonal structure.

製品名

Boron Nitride (BN) Pristine Flakes in Solution, 100 ml

サイズ・数量・仕様

Lateral Size: 50-200 nm
Thickness: 1-5 Monolayers
Purity in Dry Phase: >99%
Solution Concentration: 5.4 mg/L
Solution is stable under ambient conditions

製品名

CVD Graphene Film/CVD h-BN Film Heterostructure on SiO2/Si wafer

サイズ・数量・仕様

Single Layer Graphene Film on Single Layer h-BN Film transferred onto 285 nm (p-doped) SiO2/Si wafer
Size: 1cmx1cm;
The thickness and quality of each film is controlled by Raman Spectroscopy
The coverage of this product is about 98%
The films are continuous, with minor holes and organic residues

製品名

Boron Nitride (BN) Micropowder - 100 grams

サイズ・数量・仕様

Purity: 98%
Average Particle Size: 5 microns
Specific Surface Area: 7.5

製品名

Boron Nitride (BN) Ultrafine Powder - 5 Grams

サイズ・数量・仕様

Purity: 99.0%
Average Particle Size: ~70 nm (determined from SSA)
Specific Surface Area: ~20 m2/g
Bulk Density: 0.30 g/cm3
True density: 2.25 g/cm3

製品名

Tungsten Disulfide (WS2) Pristine Flakes in Solution, 100 ml

サイズ・数量・仕様

Lateral Size: 50-150 nm
Thickness: 1-4 monolayers
Purity in dry phase: >99%
Solution Concentration: 26 mg/L
Solution is stable under ambient conditions
This solution can be easily deposited onto a substrate or surface of your choice to form a thin film coating.

製品名

Single Layer Hexagonal Boron Nitride on 285 nm SiO2/Si, (p-doped), 1cmx1cm

サイズ・数量・仕様

97% coverage with minor holes and organic residues
High Crystalline Quality
The Raman spectrum should peak at ~1369cm-1

製品名

Molybdenum Disulfide (MoS2) Crystal

サイズ・数量・仕様

[Regular] One or two crystals | [Large] One crystal
[Regular] 0.7cm2 average area, or more | [Large] 2cm2 average area, or more
purity: >99%

製品名

Molybdenum Disulfide (MoS2) Pristine Flakes in Solution, 100 ml

サイズ・数量・仕様

Lateral Size: 100-400 nm
Thickness: 1-8 monolayers
Purity in dry phase: >99%
Solution Concentration: 18 mg/L
Solution is stable under ambient conditions

製品名

MoS2 Ultrafine Powder - 5 grams

サイズ・数量・仕様

Purity: 99.0%
Average Particle Size: ~90 nm
Specific Surface Area: ~35 m²/g
Morphology: nearly spherical
Bulk Density: ~0.78 g/cm³
True density: 5.06 g/cm³

製品名

Trial Kit: Graphene-Like Solutions

サイズ・数量・仕様

Molybdenum Disulfide (MoS2) Solution, 50 ml
Tungsten Disulfide (WS2) Solution, 50 ml
Boron Nitride (BN) Solution, 50 ml

製品名

WS2 Ultrafine Powder - 5 Grams

サイズ・数量・仕様

Purity: 99.0%
Average Particle Size: ~90 nm
Specific Surface Area: ~30 m2/g
Morphology: nearly spherical
Bulk Density: N/A
True density: 7.50 g/cm3

製品名

WS2 Micropowder - 100 grams

サイズ・数量・仕様

Average Particle Size: 0.4-1 microns
Purity: 99%

製品名

Micronized Graphite, 45 µm, 96%

サイズ・数量・仕様

Micronized Flake Graphite, 45 micron, 96%, carbon content

製品名

Micronized Graphite, 25 µm, 96%

サイズ・数量・仕様

Micronized Flake Graphite, 25 micron, 96%, carbon content

製品名

Micronized Graphite, 15 µm, 96%

サイズ・数量・仕様

Micronized Graphite, 15 µm, 96%

製品名

High Purity Micronized Graphite, 5 µm, 99%

サイズ・数量・仕様

High Purity Micronized Graphite, 5 µm, 99%

製品名

High Purity Micronized Graphite, 45 µm, 99%

サイズ・数量・仕様

High Purity Micronized Graphite, 45 µm, 99%

製品名

High Purity Micronized Graphite, 10 µm, 99%, 100g

サイズ・数量・仕様

High Purity Micronized Graphite, 10 µm, 99%, 100g

製品名

High Purity Micronized Graphite, 25 µm, 99%

サイズ・数量・仕様

High Purity Micronized Flake Graphite, 25 micron, 99%, carbon content, 100g

製品名

High Purity Micronized Graphite, 15 µm, 99%

サイズ・数量・仕様

High Purity Micronized Flake Graphite, 15 micron, 99%, carbon content, 100g
General Characteristics
Formula: Carbon
Aspect: Fine black powder
Purity: 99.5-99.99% C

製品名

Ultrafine Powder Trial Kit

サイズ・数量・仕様

Molybdenum Disulfide (MoS2) Ultrafine Powder, 5 grams
Tungsten Disulfide (WS2) Ultrafine Powder, 5 grams
Boron Nitride (BN) Ultrafine Powder, 5 grams

製品名

Conductive Graphene Dispersion

サイズ・数量・仕様

Graphene Nanoplatelets: Average thickness - 7 nm
23 wt% Total graphene content
Solvent: N-Butyl acetate
Proprietary dispersant (2%)

製品名

Pristine Graphene Monolayer Flakes (50 ml)

サイズ・数量・仕様

Dispersion in ethanol.
Concentration: 1 mg/L
Carbon content: 99.99%
Ultrapure: no oxidation, no surfactants
Average flake thickness: 0.35 nm (1 monolayer)
Average Particle (lateral) size: ~ 550 nm (150-3000) nm.

製品名

Graphene Nanopowder: Grade C-1

サイズ・数量・仕様

25G / 100G / 500G
Specific surface area: 60 m2/g
Color: Black
Purity: 97%
Average flake thickness: 5-30nm
Average Particle (lateral) size: ~ 5-25 microns
Packaged in 12oz, 32oz, 1/2 gallon jars

製品名

Single Layer Graphene Oxide

サイズ・数量・仕様

Dry powder
Color: Brown
Composition: Carbon (79%), Oxygen (20%)
Flake size: 0.5-5 microns.
Thickness: 1 atomic layer - at least 80%.

製品名

Single Layer Graphene Oxide (Small Flakes): 1g

サイズ・数量・仕様

Dry paper-like powder
Color: Brown
Composition: Carbon (79%), Oxygen (20%)
Flake size: 0.3-0.7 microns.
Thickness: 1 atomic layer - about 50%.

製品名

High Surface Area Reduced Graphene Oxide 75 mg

サイズ・数量・仕様

75 MG (DRY BLACK POWDER)
Specific surface area: 833 m2/g
Color: Black
Solid content: 98%
Carbon/Oxygen Ratio: 10.5
Average flake thickness: 1 monolayer
Average Particle (lateral) size: ~3-5 microns.

製品名

Carbon Black: 100 Grams

サイズ・数量・仕様

Surface Area: 254 m2/g
Particle Size: 30 nm
Carbon Content: 99% or more

製品名

Multi-Walled Carbon Nanotube Powder, 100 grams

サイズ・数量・仕様

Diameter: 50-85 nm
Length: 10-15 micrometers
Nitrogen Surface Area: 60-90 m2/g
Volume Resistivity: 2i<<5x10-4 Ω⋅cm
Carbon Content: >94%

製品名

Nanostructured Graphite-250

サイズ・数量・仕様

Specific Surface Area: 250 m2/g
Lateral Size: 100 nm-500 nm
Thickness: 10-300 nm
Weight: 25g
Packaged in 12oz jars
Ultrafine Natural Nanographite is a high surface area material,
produced by splitting of natural graphite. There is no oxidation or use of surfactants.

製品名

Flake Graphite: 100 grams

サイズ・数量・仕様

As the name implies, flake graphite has a distinctly flaky or platy morphology.
Graphite is formed when pure carbon atoms link together to form flat sheets,
which manifest themselves as large visible flakes or coarsely crystalline graphite.
+100 mesh (150 microns or more in lateral size)
Purity 99.9%
Size:100g

製品名

High Crystalline Natural Graphite

サイズ・数量・仕様

Size:10g・25g
Ultrapure: Carbon content is >99.75%
Lateral Dimensions: 10-75 microns
Nearly perfect crystal structure
This material is perfect for many applications which utilize graphene synthesis from graphite.
It is generally more affordable than kish graphite for graphene-related applications.

製品名

Nanostructured Graphite-400

サイズ・数量・仕様

Specific Surface Area: 400 m2/g
Lateral Size: 100 nm-500 nm
Thickness: 10-300 nm
Weight: 25g
Packaged in 12 oz jars
Ultrafine Natural Nanographite is a high surface area material,
produced by splitting of natural graphite. There is no oxidation or use of surfactants.

製品名

Micronized Graphite, 45 µm, 96%

サイズ・数量・仕様

Size:250g・500g
General Characteristics
Formula: Carbon
Aspect: Fine black powder
Purity: 96% C on average
Guaranteed Ash Values
0.1% Maximum LOI
Guaranteed Values
Moisture: 0.5% Max
D50 (Laser Diffraction): 45 μm
Particle Size Distribution
D90 102.4
D50 45.5
D10 13.1

製品名

Micronized Graphite, 25 µm, 96%

サイズ・数量・仕様

Size:250g・500g
Formula: Carbon
Aspect: Fine black powder
Purity: 96.4% C typical value
Guaranteed Ash Values
0.1% Maximum LOI
Guaranteed Values
Moisture: 0.5% Max
D50 (Laser Diffraction): 25 μm
Particle Size Distribution
D90 40.4
D50 23.6
D10 9.4

製品名

Micronized Graphite, 15 µm, 96%

サイズ・数量・仕様

Size:250g・500g
General Characteristics
Formula: Carbon
Aspect: Fine black powder
Purity: 96% C on average
Guaranteed Ash Values
0.1% Maximum LOI
Guaranteed Values
Moisture: 0.5% Max
D50 (Laser Diffraction): 17 μm
Particle Size Distribution
D90 35.9
D50 16.8
D10 6.2

製品名

High Purity Micronized Graphite, 5 µm, 99%

サイズ・数量・仕様

Size:100g・500g
General Characteristics
Formula: Carbon
Aspect: Fine black powder
Purity: 99.5-99.99% C
Guaranteed Ash Values
0.1% Maximum LOI
Guaranteed Values
Moisture: 0.5% Max
D50 (Laser Diffraction): 5 μm
Particle Size Distribution
D90 9.79
D50 4.85
D10 1.78

製品名

High Purity Micronized Graphite, 45 µm, 99%

サイズ・数量・仕様

Size:100g・500g
General Characteristics
Formula: Carbon
Aspect: Fine black powder
Purity: 99.5-99.99% C
Guaranteed Ash Values
0.1% Maximum LOI
Guaranteed Values
Moisture: 0.5% Max
D50 (Laser Diffraction): 45 μm
Particle Size Distribution
D90 17.4
D50 5.78
D10 1.58

製品名

High Purity Micronized Graphite, 15 µm, 99%

サイズ・数量・仕様

Size:100g・500g
General Characteristics
Formula: Carbon
Aspect: Fine black powder
Purity: 99.5-99.99% C
Guaranteed Ash Values
0.1% Maximum LOI
Guaranteed Values
Moisture: 0.5% Max
D50 (Laser Diffraction): 6 μm
Particle Size Distribution
D90 35.9
D50 16.8
D10 6.2

製品名

High Purity Micronized Graphite, 10 µm, 99%, 100g

サイズ・数量・仕様

General Characteristics
Formula: Carbon
Aspect: Fine black powder
Purity: 99.5-99.99% C
Guaranteed Ash Values
0.1% Maximum LOI
Guaranteed Values
Moisture: 0.5% Max
D50 (Laser Diffraction): 17 μm
Particle Size Distribution
D90 21.9
D50 11.8
D10 8.2

製品名

High Purity Micronized Flake Graphite, 25 micron, 99%, carbon content,

サイズ・数量・仕様

Size:100g・500g
General Characteristics
Formula: Carbon
Aspect: Fine black powder
Purity: 99.5-99.99% C
Guaranteed Ash Values
0.1% Maximum LOI
Guaranteed Values
Moisture: 0.1% Max
D50 (Laser Diffraction): 25 μm
Particle Size Distribution
D90 30.0
D50 23.6
D10 9.4

製品名

Coronene: 250 mg

サイズ・数量・仕様

Purity: 97%
Form: Yellow-Yellow Gold Fibrous Powder
Weight: 250 mg

製品名

Amorphous Graphite - 100 Grams

サイズ・数量・仕様

325 Mesh (44 Microns or more in lateral size)
Carbon content: 80% or more

製品名

Conductive Graphene Sheets

サイズ・数量・仕様

Size 8”ｘ4” ・8"x8"
Set: 5pack / 10pack / 20pack
Carbon Content: 97%
Thickness: 25 micrometers
Density: 2 g/cm3
Thermal Conductivity: x-y plane, 1300-1500 W/(m)x(k); z plane, 13-15 W/(m)x(k)
Tensile Strength: 30 MPa
Sheet Resistance: 2.8 x 10-2 ohm/square

製品名

Graphene on Aluminum Foil

サイズ・数量・仕様

Size: 9"x8.5"
5 Sheets
Average Thickness: 3.5nm
Lateral Size of individual graphene flakes: 5-10μm
The flakes coat the surface to form a conductive layer
Properties of aluminum foil:
Thickness: 16μm
Electrical Resistivity- 4.5x10-6 Ω.cm

製品名

Blank Aluminum Foil

サイズ・数量・仕様

Size: 9"x10"
5 Sheets
Purity > 99.3%
Thickness: 15 um
Tensile Strength: ≥150N/m3

製品名

CVD Graphene TEM Grid on Copper 2000 support

サイズ・数量・仕様

Size: 5pack ・25pack
CVD Graphene film deposited on Copper TEM grids (2000 Mesh).
We use CVD graphene grown on Ni to prepare TEM grids
Thickness of CVD Graphene film: 0.3-2 nm (1-6 monolayers)
Typical graphene coverage: 60-90%

製品名

CVD Graphene TEM Grid on Lacey Carbon Support

サイズ・数量・仕様

Size: 5pack・25pack
CVD Graphene film deposited on lacey carbon TEM grids, 300 Mesh.
We use CVD graphene grown on Ni to prepare TEM grids
Thickness of CVD Graphene film: 0.3-2 nm (1-6 monolayers)
Typical graphene coverage: 60-90%
Ultrathin CVD Graphene grids provide the ideal specimen support to achieve
high resolution data in TEM imaging making them an ideal choice many TEM applications such as:

製品名

Silicon/Silicon dioxide wafer: 4" Diameter, P-type

サイズ・数量・仕様

Set: 1pack・5pack
Diameter: 100 mm (4")
Oxide Thickness: 285 nm
Color: Violet
Wafer thickness: 500 micron
Resistivity: 0.001-0.005 Ω·cm
Type/Dopant: P/Boron
Orientation:
Front Surface: Polished
Back Surface: Etched

製品名

Silicon/Silicon dioxide (90 nm) wafers: 4" Diameter, P-type

サイズ・数量・仕様

Set: 1pack ・5pack
Diameter: 100 mm (4")
Oxide Thickness: 90 nm
Color: Violet
Wafer thickness: 525 micron
Resistivity: 0.001-0.005 Ω·cm
Type/Dopant: P/Boron
Orientation:
Front Surface: Polished
Back Surface: Etched

製品名

Double Sided Graphene Transfer Tape: 5 Pack

サイズ・数量・仕様

Thermal Release Tape, 5 pack
Size: 200 mm x 200 mm
100ºC release temperature

製品名

Blank Quartz Substrate: 1" x 1"

サイズ・数量・仕様

Pack: 1pack・5pack
Blank quartz substrate, size 1" x 1" inch by 1 mm
Properties of Quartz Substrate:
We use G.E. 124 Fused Quartz Substrates
Knoop Hardness: >600 Kg/mm2
Density: 2.21 g/cm3

製品名

Silicon/Silicon dioxide wafer: 4" Diameter, N-type

サイズ・数量・仕様

Set: 1pack ・5pack
Diameter: 100 mm (4")
Oxide Thickness: 285 nm
Color: Violet
Wafer thickness: 525 micron
Resistivity: 0.001-0.005 Ω·cm
Type/Dopant: N/Arsenic
Orientation:
Front Surface: Polished
Back Surface: Etched

製品名

Blank Glass Substrate: 1"x1"

サイズ・数量・仕様

Pack: 1pack ・5pack
Thickness: 0.7 mm
Density: 2.38 g/cc